Collection Industry Research 2026.07.12

Basic Concepts to Know When Studying Semiconductors for the First Time

A collection of introductory keywords to understand semiconductor industry news such as memory, logic, foundry, fabless, wafer, and process miniaturization.

Semiconductor news may seem familiar, but it can be difficult to grasp once you start reading. Understanding how memory and logic differ, why foundries and fabless companies are distinct, and the meaning of wafers and process miniaturization can help you see corporate news and industry trends. With nearly every industry, including AI, electric vehicles, smartphones, data centers, and defense, connected to semiconductors, understanding these basic concepts has become even more important. This list outlines core terms that are good for those starting to study semiconductors.

Memory Semiconductor

Memory Semiconductors

Memory semiconductors are responsible for storing data. DRAM is used for fast data reading and writing, while NAND is widely used in storage devices that retain data even when powered off. Recently, HBM, which is crucial for bandwidth in AI servers, has gained significant attention. The memory industry experiences high performance fluctuations depending on demand, supply, inventory, and average selling price, so it's essential to observe market cycles. Understanding that memory prices are sensitive to price cycles and customer inventory as well as data center investment flows will make interpreting news easier.

유형 제품 분류 핵심 포인트 DRAM, NAND, HBM, 가격 사이클, 재고 이해 팁 메모리 뉴스는 수요보다 가격과 재고를 함께 보기

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Logic Semiconductor

Logic Semiconductors

Logic semiconductors are used to calculate and control data rather than store it. Chips that serve as the brains of systems, such as CPUs, GPUs, mobile APs, network chips, and AI accelerators, are representative examples. In logic semiconductors, design capabilities, manufacturing processes, and power efficiency are crucial, and performance differences across products contribute to corporate competitiveness. In the age of AI, the demand for GPUs and AI accelerators has increased, making logic chips even more important. When examining the logic industry, it is essential to check who designs the chips, which foundry manufactures them, and what processes are used.

유형 제품 분류 핵심 포인트 CPU, GPU, AP, AI 가속기, 전력 효율 이해 팁 설계 기업과 제조 파운드리를 분리해서 이해

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Foundry

Foundries play a key role in the structure where semiconductor design companies do not directly operate factories but instead outsource manufacturing to external manufacturers. Representative foundry companies take customer chip designs and create actual products through wafer processes. A foundry's competitiveness arises from advanced processes, yield, production capacity, customer trust, and packaging capabilities. As AI chips, mobile APs, and HPC chips become more complex, the importance of advanced foundries increases. However, substantial equipment investment and process transition risks necessitate looking at long-term technology roadmaps.

유형 사업 모델 핵심 포인트 위탁생산, 공정 기술, 수율, 고객사 이해 팁 팹리스와 파운드리의 역할을 나눠 보기

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Fabless

Fabless companies focus on semiconductor design without owning manufacturing plants. They design the chip's structure, functionality, power efficiency, and software support while outsourcing actual production to foundries. The fabless model is very important in areas like GPUs, mobile APs, network chips, and AI accelerators. When considering fabless companies, it is essential to look not only at design capabilities but also at which foundry they are partnering with and whether they have secured surrounding ecosystems like packaging and HBM. Even without direct manufacturing, securing a supply chain can significantly impact performance.

유형 사업 모델 핵심 포인트 설계 전문, 파운드리 협력, IP, 소프트웨어 이해 팁 좋은 설계도 생산능력과 패키징이 따라야 함

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Wafer

Wafers are the starting point of semiconductor manufacturing. Processes such as oxidation, photolithography, etching, deposition, and ion implantation are repeated on a round silicon disc to create fine circuits. Many chips are produced from a single wafer, which then undergoes testing, cutting, and packaging to become the final product. Wafer size, defect rate, and process complexity all affect productivity and costs. When looking at semiconductor news, references to wafer input or wafer shipment volumes can be understood as auxiliary indicators of actual chip production scale and market conditions.

유형 제조 기본 단위 핵심 포인트 실리콘 원판, 공정 반복, 칩 절단, 생산성 이해 팁 웨이퍼는 반도체가 만들어지는 시작점으로 보기

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Process Miniaturization

Process miniaturization is a frequently encountered keyword in the semiconductor industry. Implementing circuits with smaller line widths allows for placing more transistors in the same area, enhancing performance and power efficiency. However, photolithography equipment, materials, design rules, and yield management become very challenging, and investment costs rise sharply. Consequently, advanced processes have become an area where only a few companies can compete. The number of processes also serves a marketing purpose, so it is important to examine performance, power, yield, and the applicability of customer products, rather than simply comparing nm numbers.

유형 제조 기술 핵심 포인트 미세공정, 성능, 전력 효율, 수율, 투자비 이해 팁 nm 숫자만 보지 말고 실제 제품 적용을 확인

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Yield

Yield is a crucial concept in semiconductor manufacturing. Even when the same wafer is used, a higher ratio of functioning chips lowers costs and increases supply. Advanced processes or new products may have lower initial yields, requiring time to stabilize them. Low yield can make it difficult to meet customer delivery schedules and can negatively impact profitability. When semiconductor companies report terms like 'mass production,' 'yield stabilization,' and 'customer certification,' it's better to see them not just as technical announcements but also in relation to actual sales conversion possibilities.

유형 생산 지표 핵심 포인트 정상 칩 비율, 원가, 양산 안정성, 고객 인증 이해 팁 기술 발표보다 수율과 양산 여부가 중요

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Packaging

Packaging was once considered the final packaging stage of semiconductor manufacturing, but it has now become a core technology that determines performance. It involves bundling multiple chips within a single package, closely connecting high-bandwidth memory like HBM, and ensuring stable power and signal transmission. In AI semiconductors, the movement of data between computation chips and memory is crucial, elevating the value of advanced packaging. Technologies like TSMC's CoWoS are often mentioned as representative examples of integrating logic chips and HBM in AI and HPC applications.

유형 후공정·통합 기술 핵심 포인트 첨단 패키징, HBM, 칩렛, 신호 연결 이해 팁 AI 반도체는 공정만큼 패키징도 함께 보기

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The semiconductor industry is one that is hard to grasp all at once. Start with the major categories such as memory, logic, foundry, and fabless, and then expand into processes, equipment, materials, and packaging for a clearer understanding. Even if they are semiconductor companies, memory firms, design companies, manufacturing companies, and equipment companies may have different performance and risks. This list is a basic map for understanding the industry, not an investment recommendation, and it's advisable to check announcements, performance reports, and industry reports when assessing actual companies.

한눈에 보기 8개

Memory Semiconductor

제품 분류 · DRAM, NAND, HBM, 가격 사이클, 재고 · 메모리 뉴스는 수요보다 가격과 재고를 함께 보기

Logic Semiconductor

제품 분류 · CPU, GPU, AP, AI 가속기, 전력 효율 · 설계 기업과 제조 파운드리를 분리해서 이해

Foundry

사업 모델 · 위탁생산, 공정 기술, 수율, 고객사 · 팹리스와 파운드리의 역할을 나눠 보기

Fabless

사업 모델 · 설계 전문, 파운드리 협력, IP, 소프트웨어 · 좋은 설계도 생산능력과 패키징이 따라야 함

Wafer

제조 기본 단위 · 실리콘 원판, 공정 반복, 칩 절단, 생산성 · 웨이퍼는 반도체가 만들어지는 시작점으로 보기

Process Miniaturization